Comparison between moire interferometry and strain gages for effective CTE measurement in electronic packages

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 246-252

  Ratanawilai, T ^a   Hunter, B ^a   Subbarayan, G ^a   Rose, D ^a  

^a UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION METHODS; ELECTRONICS PACKAGING; INTERFEROMETRY; MEASUREMENT ERRORS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT TESTING; RELIABILITY; STRAIN GAGES; THERMAL VARIABLES MEASUREMENT;

COEFFICIENT THERMAL EXPANSION; MOIRE INTERFEROMETRY; PLASTIC BALL GRID ARRAY; THERMAL STRAIN;

THERMAL EXPANSION;

EID: 0033710191     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (17)