메뉴 건너뛰기




Volumn 44, Issue 6 A, 2005, Pages 3893-3902

An evaluation process of polymeric adhesive wafer bonding for vertical system integration

Author keywords

BCB; Bond strength; Bonding adhesive; Four point bending; FTIR analysis; Vertical system integration

Indexed keywords

ADHESIVES; BONDING; BUTENES; EVALUATION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; STRUCTURE (COMPOSITION);

EID: 23944470605     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.44.3893     Document Type: Article
Times cited : (12)

References (36)
  • 16
    • 33645432502 scopus 로고    scopus 로고
    • private communication, Air Product
    • R. N. Vrtis: private communication, Air Product.
    • Vrtis, R.N.1
  • 17
    • 33645433364 scopus 로고    scopus 로고
    • Ph. D. Thesis, Rensselaer Polytechnic Institute, Troy, NY
    • Y. Kwon: Ph. D. Thesis, Rensselaer Polytechnic Institute, Troy, NY, 2003.
    • (2003)
    • Kwon, Y.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.