On the mechanical reliability of photo-bcb-based thin film dielectric polymer for electronic packaging applications

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 1, 2000, Pages 28-33

  Im, Jang Hi ^a   Shaffer, Edward O ^a   Stokich, Theodore ^a   Strandjord, Andrew ^a,b   Hetzner, Jack ^a   Curphy, James ^a   Karas, Cheryl ^a   Meyers, Greg ^a   Hawn, David ^a   Chakrabarti, Ashok ^a   Froelicher, Steve ^a  

^a DOW CHEMICAL COMPANY   (United States)

^b IC Interconnects   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039304077     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.483128     Document Type: Article

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