Low k, Porous Methyl Silsesquioxane and Spin-On-Glass

Electrochemical and Solid-State Letters

Volumn 2, Issue 2, 1999, Pages 77-79

  Kohl, Abbe T ^a   Mimna, Richard ^b   Shick, Robert ^b   Rhodes, Larry ^b   Wang, Z L ^a   Kohl, Paul A ^a  

^a Georgia Institute of Technology   (United States)

^b GOODRICH CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DECOMPOSITION; INFRARED SPECTROSCOPY; PERMITTIVITY; POROUS SILICON;

METHYL SILSESQUIOXANE; POLYMER FILM MIXTURE; POROUS FILMS; TRIETHOXYSILYL GROUPS;

PLASTIC FILMS;

EID: 0033076114     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1390740     Document Type: Article

References (8)

1. N. P. Hacker, G. Davis, L. Figge, and T. Krajewski, in Low Dielectric Constant Materials III, C. Case, P. Kohl, T. Kikkawa, and W. Lee, Editors, Vol. 476, p. 25, Materials Research Society, Warrendale, PA (1997).
2. C. T. Chua, G. Sarkar, and X. Hu, J. Electrochem. Soc., 145, 4007 (1998).
3. M. J. Loboda, C. M. Grove, and R. F. Schneider, J. Electrochem. Soc., 145, 2861 (1998).
4. Allied Signal Advanced Materials, Accuglass 512 Spin-On Glass (SOG), product bulletin (1992).
5. Allied Signal Advanced Materials, Accuspin T-18 Flowable Spin-On Polymer (SOP), product bulletin (1997).
6. P. A. Kohl, Q. Zhao, K. Patel, D. Schmidt, S. A. Bidstrup, R. Shick, and S. Jayaraman, Electrochem. Solid-State Lett., 1, 49 (1998).
7. American Society for Testing and Materials, D150-92, Standard Test Methods for AC Loss Characteristics and Permittivity (dielectric constant) of Solid Electrical Insulating Materials, Philadelphia, PA (1992).
8. H. Mdynen, J. Waeterloos, B. Coenegrachts, T. Gao, J. Grillaert, and L. Van den hove, Presented at Allied Signal Planar 96 Conference, Santa Clara, CA (1996).