Electromigration in Sputtered Copper Film on Plasma-Treated Hydrogen Silsesquioxane Dielectric

Journal of Electronic Materials

Volumn 33, Issue 4, 2004, Pages 368-373

  Chen, Chi Tong ^a   Chiou, Bi Shiou ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Cu low k dielectric; Electromigration; Hydrogen silsesquioxane; Interconnect; Plasma treatment; Reliability

Indexed keywords

COPPER; CRYSTALLOGRAPHY; ELECTROMIGRATION; HYDROGEN; INTERCONNECTION NETWORKS; METALLIZING; PERMITTIVITY; PLASMAS; RELIABILITY; TEXTURES; ULSI CIRCUITS;

INTERFACIAL DIFFUSION; PLASMA TREATMENT; SPUTTERED COPPER FILMS;

DIELECTRIC FILMS;

EID: 2342616242     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0145-3     Document Type: Article

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