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Journal of Materials Science: Materials in Electronics

Volumn 12, Issue 11, 2001, Pages 655-659

The effect of polyimide passivation on the electromigration of Cu multilayer interconnections

(2) Jiang, Jiann Shan a Chiou, Bi Shiou a

a NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER; CURRENT DENSITY; ELECTROMIGRATION; METALLIZING; MULTILAYERS; OSCILLATIONS; PASSIVATION;

ELECTROMIGRATION DAMAGE (EMD); ISOTHERMAL RESISTANCE;

POLYIMIDES;

EID: 0035517621 PISSN: 09574522 EISSN: None Source Type: Journal
DOI: 10.1023/A:1012802117916 Document Type: Article

Times cited : (14)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.