Electromigration in sputtered copper films on polyimide

Journal of Materials Science: Materials in Electronics

Volumn 10, Issue 4, 1999, Pages 267-271

  Wang, Hsueh Wen ^a   Chiou, Bi Shiou ^a   Jiang, Jiann Shan ^a  

^a Institute of Electronics   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER; CRYSTAL LATTICES; DIFFUSION IN SOLIDS; ELECTRIC CURRENTS; ELECTROMIGRATION; GRAIN BOUNDARIES; METALLIZING; POLYIMIDES;

COPPER FILMS; ELECTROMIGRATION DAMAGE; INTERFACIAL DIFFUSION PATH;

METALLIC FILMS;

EID: 0032625197     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1008964516337     Document Type: Article

References (22)

1. C. K. HU, Thin Solid Films 260 (1995) 124.
2. S. H. KANG, C. KIM, J. W. MORRIS, Jr. and F. Y. GENIN, J. Appl. Phys. 79 (1996) 8330.
3. J. R. LLOYD and R. H. KOCH, Appl. Phys. Lett. 52 (1988) 194.
4. J. R. LLOYD and J. J. CLEMENT, Thin Solid Films 262 (1995) 135.
5. R. J. GUTMANN, T. P. CHOW, S. LAKSHMINARAYANAN, D. T. PRICE, J. M. STEIGERWALD, L. YOU and S. P. MURARKA, ibid. 270 (1995) 472.
6. F. S. OHUCHI and S. C. FREILICH, J. Vac. Sci. Technol. A 6 (1988) 1004.
7. C.-K. HU, B. LUTHER, F. B. KAUFMAN, J. HUMMEL, C. UZOH and D. J. RERSON, Thin Solid Films 262 (1995) 84.
8. T. NITTA, T. OHMI, T. HSOHI, S. SAKAI, K. SAKAIBARA, S. IMAI andT. SHIBATA, J. Electrochem. Soc. 140 (1993) 1131.
9. N. H. E. WEATE and K. ESHRAGHIAN, "Principles of CMOS VLSI Design", 2nd Edn (Addison Wesley Company, CA, 1993) p. 145.
10. D. S. SOANE and Z. MARTYNENKO, "Polymers in Microelectronics: Fundamentals and Applications" in Polyimide Use in IC fabrication, (Elsevier Science Publishers, 1989) p. 153.
11. J.-C. CHIOU, K.-C. JUANG and M.-C. CHEN, J. Electrochem. Soc. 142 (1995) 2326.
12. C. W. PARK and R. W. VOOK, Mater. Res. Soc. Symp. Proc. 225 (1991) 119.
13. R. E. HUMMEL, R. T. DEHOFF and H. J. GEIER, J. Phys. Chem. Solids 37 (1976) 73.
14. M. SHATZKES and J. R. LLOYD, J. Appl. Phys. 59 (1986) 3890.
15. R. ROSENBERG and L. BERENHAUM, Appl. Phys. Lett. 12 (1968) 201.
16. H. -K. KANG, Proceedings of the IEEE VMIC Conference (IEEE, New York, 1993) p. 223.
17. J. S. H. CHO, Tech. Dig. (1993) 265.
18. T. FUKADA, T. MORI, Y. TOYODA, M. HASEGAWA, K. NAMBA and K. OGATA, Appl. Surf. Sci. 91 (1995) 227.
19. B. LUTHER, Proceedings of the IEEE VMIC Conference (IEEE, New York, 1993) p. 269.
20. C. -K. HU and B. LUTHER, Mater. Chem. Phys. 41 (1995) 7.
21. M. HOROWITZ and R. W. DUTTON, IEEE Trans, on CAD Cad-2 (1983) 145.
22. R. A. SIGSBEE, J. Appl. Phys. 44 (1973) 2533.