Impression creep testing and constitutive modeling of Sn-based solder interconnects

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 95-102

  Marks, Robert A ^a   Pan, Deng ^a   Dutta, Indranath ^a   Jadhav, Susheel G ^b  

^a Naval Postgraduate School ^*  (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Coarsening; Creep modeling; Impression creep; Pb free solders; Sn Ag; Sn Ag Cu; Thermomechanical cycling

Indexed keywords

COARSENING; CREEP MODELING; IMPRESSION CREEP; PB-FREE SOLDERS; SN-AG; SN-AG-CU; THERMOMECHANICAL CYCLING;

CREEP TESTING; ELASTIC MODULI; FLIP CHIP DEVICES; MICROSTRUCTURE; PRECIPITATION (CHEMICAL); REACTION KINETICS; RELIABILITY; SHEAR STRENGTH; SOLDERED JOINTS; THERMAL CYCLING; THERMAL EXPANSION; TIN ALLOYS;

SOLDERING;

EID: 4444272185     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

1. I. Dutta et al., "Underfill Constraint Effects during Thermomechanical Cycling of Flip-Chip Solder Joints", Journal of Electronic Materials, 31 253 (2002).
2. W. Yang et al., "Microstructure Evolution of Eutectic SnAg Solder Joints", Journal of Electronic Materials, 23 765 (1994).
3. D. Frear et al., "Microstructurally Based Finite Element Simulation of Solder Joint Behaviour", Solder Surface Mount Technology, 25 35 (1997).
4. H. Conrad et al., "Influence of Microstructure Size on the Plastic Deformation Kinetics, Fatigue Crack Growth Rate, and Low-Cycle Fatigue of Solder Joints", Journal of Electronic Materials, 28 1062 (1999).
5. P. Hacke et al., "Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening", Journal of Electronic Packaging, 115 153 (1993).
6. J.C.M. Li, "Impression Creep and Other Localized Tests", Materials Science and Engineering A, 322 23 (2002).
7. K.L. Murty, "Technological Applications of Crystallographic Textures of Zirconium Alloys", Metals Forum, 15 217(1991).
8. D. Dorner et al., "Creep of a TiAl Alloy: a Comparison of Indentation and Tensile Testing", Materials Science and Engineering A, in press.
9. D. Pan and I. Dutta, "A Complication of Impression Creep Tests and its Solution: Application to Sn-3.5Ag Solders", submitted to Materials Science and Engineering A.
10. I. Dutta et al., "Impression Creep Characterization of Rapidly Cooled Sn-3.5Ag Solders", submitted to Materials Science and Engineering A.
11. M.A. Clark and T.H. Alden, "Deformation Enhanced Grain Growth in a Superplastic Sn-l%Bi Alloy", Acta Metallurgica, 21 1195 (1973).
12. O.N. Senkov and M.M. Myshlyaev, "Grain Growth in Superplastic Zn-22%Al Alloy", Acta Metallurgica, 34 97 (1986).
13. G.S. Ansell and J. Weertman, "Creep of Dispersion-Hardened Aluminum Alloy", Transactions of the Metallurgical Society of AIME, 215 838 (1959).
14. M. Liftshitz and V. Slyolov, "The Kinetics of Precipitation from Supersaturated Solid Solutions", Journal of Physical Chemistry of Solids, 19 35 (1961).
15. C. Wagner, "Theorie der Alterung von Niedeschlägen durch Umlösen (Ostwald-Reifung)", Zeitschrift für Elektrochemie 65 581 (1961).
16. I. Dutta, "A Constitutive Model for Creep of Lead-Free Solders Undergoing Strain-Enhanced Microstructural Coarsening: A First Report", Journal of Electronic Materials, 32 201 (2003).
17. F. Vnuk et al., "The Solid Solubility of Silver, Gold, and Zinc in Metallic Tin", Journal of Materials Science 16 1171 (1981).
18. Smithells Metals Reference Book-7th Edition, edited by E.A. Brandes and G.B. Brook, Butterworth-Heinemann Ltd. (1992) p. 13-25.
19. J.C. Wurst and J.A. Nelson, "Linear Intercept Technique for Measuring Grain Size in Two-Phase Polycrystalline Ceramics", Journal of the American Ceramic Society, 55 109 (1972).