Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis

International Journal of Adhesion and Adhesives

Volumn 24, Issue 2, 2004, Pages 135-142

  Kwon, Woon Seong ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Anisotropic conductive films (ACFs); C. Stress analysis; C. Thermal analysis; Thermo mechanical analysis

Indexed keywords

ADHESIVE JOINTS; ANISOTROPY; BONDING; COOLING; CURING; ELECTRIC CONDUCTIVITY; FLIP CHIP DEVICES; SHRINKAGE; STRESS ANALYSIS; THERMOANALYSIS; THERMOMECHANICAL TREATMENT;

ANISOTROPIC CONDUCTIVE FILMS (AFC); SHRINKAGE STRESSES;

CONDUCTIVE FILMS;

EID: 1642437908     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2003.07.003     Document Type: Article

References (4)

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