Imaging and analysis of subsurface Cu interconnects by detecting backscattered electrons in the scanning electron microscope

Journal of Applied Physics

Volumn 97, Issue 11, 2005, Pages

  Gignac, L M ^a   Kawasaki, M ^b   Boettcher, S H ^c   Wells, O C ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b JEOL USA INC   (United States)

^c IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACKSCATTERED ELECTRONS (BSE); BEAM CURRENTS; ELECTRON BEAM ENERGY; WATER VAPOR;

BACKSCATTERING; CHARACTERIZATION; CHEMICAL MECHANICAL POLISHING; COPPER; IMAGING SYSTEMS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON; SURFACE STRUCTURE; SURFACE TOPOGRAPHY; TRANSMISSION ELECTRON MICROSCOPY;

OPTICAL INTERCONNECTS;

EID: 20544452746     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1927276     Document Type: Article

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