Smart-Cut® technology: From 300 mm ultrathin SOI production to advanced engineered substrates

Solid-State Electronics

Volumn 48, Issue 6, 2004, Pages 1055-1063

  Maleville, Christophe ^a   Mazuré, Carlos ^a  

^a PARC TECHNOLOGIQUE DES FONTAINES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POWER UTILIZATION; ION IMPLANTATION; LEAKAGE CURRENTS; MOSFET DEVICES; SILICON CARBIDE; SILICON WAFERS; SINGLE CRYSTALS; SUBSTRATES; THICKNESS MEASUREMENT; THIN FILMS; ULSI CIRCUITS;

HYDROGEN IMPLANTATION; NANOTOPOGRAPHY; WAFER BONDINGS;

SILICON ON INSULATOR TECHNOLOGY;

EID: 1442360367     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sse.2003.12.029     Document Type: Article

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