Thermal design of a ultra-slim notebook computer

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 15-21

  Kobayashi, Takashi ^a   Ogushi, Tetsuro ^a   Sumi, Noriaki ^a   Fujii, Masao ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER HARDWARE; COOLING; FINITE VOLUME METHOD; HEAT CONDUCTION; HEAT RADIATION; LAPTOP COMPUTERS; MAGNESIUM ALLOYS; NATURAL CONVECTION;

HEAT REJECTION; NATURAL CONVECTION COOLING; THERMAL DESIGN;

ELECTRONICS PACKAGING;

EID: 0031638608     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)