Heat rejection limits of air cooled plane fin heat sinks for computer cooling

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 1-8

  Saini, Manish ^a   Webb, Ralph L ^a  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

Author keywords

Air cooling limit; Convection resistance; Duct flow; Fan; Fin geometry; Heat sink; Impinging flow

Indexed keywords

COOLING; FANS; HEAT CONVECTION; MOUNTINGS; OPTIMIZATION; PERSONAL COMPUTERS;

COMPUTER COOLING; IMPINGING FLOW;

FINS (HEAT EXCHANGE);

EID: 0036455795     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (14)

1. Intel Pentium 4 Data sheet, Table 37, p 93, January 2002. http://developer.intel.com/design/Pentium4/datashts/.
2. Copeland D., "Thermal Design Tradeoffs for Ducted Heat Sinks With Dedicated Fans", Proc. of Int. Electronic Packaging Technical Conf., IPACK2001 - 15795, 2001.
3. Cohen A.V., and Iyengar M., "Design and Optimization of air cooled Heat Sinks for Sustainable Development", Proc. of Int. Conf. Thermes, pp. 5-23, 2002.
4. Culham J.R. and Muzychka Y.S., "Optimization of Plate Fin Heat Sinks Using Entropy Generation Minimization", IEEE Transc. On Comp. And Packag. Tech., Vol. 24, No. 2, pp. 159-165, 2001.
5. Loh C.K., Nelson D. and Chou D.J., "Optimization of Heat Sink Design and Fan Selection in Portable Electronics Environment", March 22, 2002. http://www.enertron-inc.com/PDF/Fan%20Heat%20Sink%20 Optimization.pdf.
6. Mansuria M.S. and Kamath V., "Design Optimization of a High Performance Heat Sink/Fan Assembly", Proc. of ASME, HTD-Vol. 292, pp. 95-103, 1994.
7. Gwinn J.P., and Webb R.L., "Performance and Testing of Thermal Interface Materials", Proc. of Thermes, pp. 201-210, 2002.
8. Lee S., Song S., Au V., Moran K.P., "Constriction/Spreading Resistance Model for Electronics Packaging", Proc. ASME/JSME Thermal Engineering Conference, Vol. 4, pp. 199-206, 1995.
9. Saini M., and Webb R.L., "Validation of Models for Air Cooled Plane Fin Heat Sinks used in Computer Cooling", Proc. of I Therm, 2002.
10. Biber C.R., "Pressure Drop and Heat Transfer in an Isothermal Channel with Impinging Flow", IEEE Trans. on Comp. And Packag. Tech. - Part A, Vol. 20, No. 4, pp. 458-462, 1997.
11. Bleier F.P., "Fan Handbook: Selection, Application and Design", McGraw Hill, 1997.
12. Intel Pentium 4 Processor Thermal Solution Functional Specifications, Section 4.5, p. 11, September, 2001. http://developer.intel.com/design/Pentium4/guides/.
13. Kondo Y., Behnia M., Nakayama W. and Matsuhima H., "Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages", Trans. ASME, Journal of Electronic Packaging, Vol. 120, pp. 259-266, 1998.
14. Manglik R.M. and Bergles A.E., "Heat Transfer and Pressure Drop Correlations for the Rectangular Offset Strip Fin Compact Heat Exchanger", Experimental Thermal and Fluid Science, Vol. 10, pp. 171-180, 1995.