메뉴 건너뛰기




Volumn 44, Issue 2, 2004, Pages 333-338

Load characterization during transportation

Author keywords

[No Author keywords available]

Indexed keywords

ACCELEROMETERS; COMPUTER MONITORS; LIFE CYCLE; MATERIALS HANDLING; PIEZOELECTRICITY; RELIABILITY; SENSORS; TRANSPORTATION;

EID: 0942266453     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00189-6     Document Type: Article
Times cited : (5)

References (14)
  • 1
    • 0028467726 scopus 로고
    • Predicting the reliability of electronic equipment
    • Pecht M., Nash F. Predicting the reliability of electronic equipment. Proc. IEEE. 82(7):1994;992-1004.
    • (1994) Proc. IEEE , vol.82 , Issue.7 , pp. 992-1004
    • Pecht, M.1    Nash, F.2
  • 3
    • 0942302265 scopus 로고    scopus 로고
    • Reliability engineering in the 21st century - A focus on predicting the reliability of electronic products and systems
    • Dalian, China, August, 28-31
    • Pecht M. Reliability engineering in the 21st century - a focus on predicting the reliability of electronic products and systems. In: Proceedings of the 5th ICRMS 2001, Dalian, China, August 2001, vol. 1. p. 1-19, 28-31.
    • (2001) Proceedings of the 5th ICRMS 2001 , vol.1 , pp. 1-19
    • Pecht, M.1
  • 4
    • 0009766999 scopus 로고    scopus 로고
    • Development and activities of the IEEE Reliability Standards Group
    • Pecht M., Ramakrishnan A. Development and activities of the IEEE Reliability Standards Group. J. Reliab. Eng. Assoc. Jpn. 22(8):2000;699-706.
    • (2000) J. Reliab. Eng. Assoc. Jpn. , vol.22 , Issue.8 , pp. 699-706
    • Pecht, M.1    Ramakrishnan, A.2
  • 5
    • 0026374740 scopus 로고
    • Failure mechanisms and damage models
    • Dasgupta A., Pecht M. Failure mechanisms and damage models. IEEE Trans. Reliab. 40(5):1991;531-536.
    • (1991) IEEE Trans. Reliab. , vol.40 , Issue.5 , pp. 531-536
    • Dasgupta, A.1    Pecht, M.2
  • 6
    • 0343215287 scopus 로고
    • Rating systems for electronic tubes and valves and analogous semiconductor devices (Last reviewed in July 1994 by the IEC Technical Committee 39 on Semiconductors)
    • IEC Standard 60134. Rating systems for electronic tubes and valves and analogous semiconductor devices (Last reviewed in July 1994 by the IEC Technical Committee 39 on Semiconductors), 1961.
    • (1961) IEC Standard 60134
  • 7
    • 0034273857 scopus 로고    scopus 로고
    • Understanding electronic part data sheets for parts selection and management
    • Das D., Pendse N., Pecht M., Condra L., Wilkinson C. Understanding electronic part data sheets for parts selection and management. IEEE Circ. Dev. 16(5):2000;26-34.
    • (2000) IEEE Circ. Dev. , vol.16 , Issue.5 , pp. 26-34
    • Das, D.1    Pendse, N.2    Pecht, M.3    Condra, L.4    Wilkinson, C.5
  • 8
    • 0031177660 scopus 로고    scopus 로고
    • Characterizing the commercial avionics thermal environment for field reliability assessment
    • Cluff K.D., Robbins D., Edwards T., Barker D. Characterizing the commercial avionics thermal environment for field reliability assessment. J. Inst. Environ. Sci. 40(4):1997;22-26.
    • (1997) J. Inst. Environ. Sci. , vol.40 , Issue.4 , pp. 22-26
    • Cluff, K.D.1    Robbins, D.2    Edwards, T.3    Barker, D.4
  • 12
    • 0942280631 scopus 로고    scopus 로고
    • U.S. MIL-STD-810F. Department of Defense Test Method Standard for Environmental Engineering Considerations and Laboratory Tests. Version F, US Government Printing Office, January 2000
    • U.S. MIL-STD-810F. Department of Defense Test Method Standard for Environmental Engineering Considerations and Laboratory Tests. Version F, US Government Printing Office, January 2000.
  • 13
    • 0142234543 scopus 로고    scopus 로고
    • Dallas, Texas, February
    • Dallas Instruments. SAVER™ User's Manual. Dallas, Texas, February 2000.
    • (2000) SAVER™ User's Manual


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.