Analysis of the micro-mechanical properties in aged lead-free, fine pitch flip chip joints

Journal of Electronic Packaging

Volumn 126, Issue 3, 2004, Pages 359-366

  Liu, Changqing ^a   Conway, Paul ^a   Li, Dezhi ^a   Hendriksen, Michael ^b  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b Celestial Limited   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; GRAIN GROWTH; INDENTATION; INTERFACES (MATERIALS); JOINTS (STRUCTURAL COMPONENTS); LEAD; MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY); RELIABILITY; SHEAR STRENGTH; SOLDERING ALLOYS; STRESS CONCENTRATION;

MICRO-SHEAR TESTING; NANO-INDENTATION; NANO-TESTING; SOLDER BUMPS;

FLIP CHIP DEVICES;

EID: 12344297639     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1773391     Document Type: Article

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