Inter-Dependence of Processing and Alloy Composition on the Reliability of Sn-Based Lead Free Solders in Fine Pitch FCOB Interconnection

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2003, Pages 99-105

  Huang, Zhiheng ^a   Conway, Paul P ^a   Liu, Changqing ^a   Thomson, Rachel C ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING; FABRICATION; LEAD; MICROSTRUCTURE; TIN ALLOYS; ALLOYING ELEMENTS; CONSUMER ELECTRONICS; COST EFFECTIVENESS; ELECTRONICS PACKAGING; GEOMETRY; INDUSTRIAL ELECTRONICS; JOINING; LABORATORIES; LAWS AND LEGISLATION; MANUFACTURE; METADATA; MICROELECTRONICS; MICROSCOPIC EXAMINATION; PHASE TRANSITIONS; RELIABILITY; SOLDERED JOINTS; SOLDERING ALLOYS; THERMODYNAMICS; TIN;

ALLOY COMPOSITION;

SOLDERING ALLOYS; LEAD-FREE SOLDERS;

COST-EFFECTIVE PRODUCTION; ELECTRONICS MANUFACTURING; EUROPE; INTERMETALLIC PRECIPITATES; MANUFACTURING TECHNIQUES; MICROELECTRONIC PRODUCTS; NATIONAL PHYSICAL LABORATORY; THERMODYNAMIC MODELLING;

EID: 0141676795     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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