Micro-scale mechanical properties of fine feature flip chip with lead free solders

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 259-266

  Liu, Changqing ^d   Geggel, M ^b   Conway, P ^a   Hendriksen, M ^c  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b Fachhochschule für Technik und Wirtschaft FHTW   (Germany)

^c Celestica Limited   (United Kingdom)

^d NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT; LEAD-FREE SOLDERS; MODIFIED ATMOSPHERE PACKAGING; OSCILLATORS (ELECTRONIC);

ALLOY SYSTEM; ELECTRONIC COMPONENT; EUROPEAN COMMUNITY; FINE FEATURE; MECHANICAL DEVICE; MECHANICAL INTEGRITY; MINIATURIZED DEVICES; WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT DIRECTIVES;

FLIP CHIP DEVICES;

EID: 84966521225     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188847     Document Type: Conference Paper

References (3)

1. D. A. Hutt, C. Liu, P. P. Conway, D. C. Whalley and S. H. Mannan, "Electroless Nickel Bumping of Aluminium Bondpads - Part I: Surface Pretreatment and Activation", IEEE Transaction on components and packaging technologies, Vol.25, No.1, March 2002.
2. D. A. Hutt, C. Liu, P. P. Conway, D. C. Whalley and S. H. Mannan, "Electroless Nickel Bumping of Aluminium Bondpads - Part II: Electroless Nickel Plating". IEEE Transaction on components and packaging technologies, Vol.25, No.1, March 2002.
3. W.C. Oliver, G.M. Pharr, "An improved technique for determinding hardness and elastics modulus using load and displacement sensing indentation experiments", Journal of materials research, Volume 7, Number 6, June 1992.