A reliability comparison of lead free and eutectic solder for stencil printing based flip-chip applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 323-330

  Yau, Esther W C ^a   Gong, J F ^a   Hong, Benny F W ^a   Chan, Philip C H ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; FLIP CHIP DEVICES; HIGH TEMPERATURE TESTING; PRINTING; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SHORT CIRCUIT CURRENTS; SOLDERING ALLOYS;

BALL SHEAR TEST; EUTECTIC SOLDER; LEAD FREE SOLDERS; SOLDER BUMP; STENCIL PRINTING;

ELECTRONICS PACKAGING;

EID: 0038350987     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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