Characterisation of intermetallic aging in flip chip solder bumps

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1767-1771

  Liu, Changqing ^a   Li, Dezhi ^a   Conway, Paul ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; BONDING; ELASTIC MODULI; HARDNESS; INTERMETALLICS; MECHANICAL VARIABLES MEASUREMENT; METALLIZING; METALLOGRAPHIC MICROSTRUCTURE; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS;

ELECTRON BACK SCATTERED DIFFRACTION; FLIP CHIP SOLDER BUMPS; INTERMETALLIC AGING; NANOINDENTATION ANALYSIS; SOLDER BUMPING; UNDER BUMP METALLIZATION;

FLIP CHIP DEVICES;

EID: 0038688107     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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