Reliability of the Pb-free solder bump on electroless Ni under bump metallurgies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 77-82

  Kim, N S ^a   Jung, S Y ^a   Oh, S Y ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MICROELECTRONIC PROCESSING; PRESSURE EFFECTS; SOLDERING; THERMAL EFFECTS;

ELECTROLESS NICKEL UNDER BUMP METALLURGY; SOLDER BUMP;

ELECTRON DEVICE TESTING;

EID: 0038351731     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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