SCOPUS 정보 검색 플랫폼

Volumn 7, Issue 12, 2004, Pages

Sealing porous low-k dielectrics with silica

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; DEPOSITION; DIELECTRIC PROPERTIES; DIFFUSION; MICROELECTRONICS; SEALING (CLOSING);

ATOMIC LAYER DEPOSITION (ALD); CHEMICAL MECHANICAL PLANARIZATION (CMP); DIELECTRIC LAYERS; TRIMETHYLALUMINUM (TMA);

POROUS SILICON;

EID: 10944274007 PISSN: 10990062 EISSN: None Source Type: Journal
DOI: 10.1149/1.1814594 Document Type: Article

Times cited : (54)

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