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Journal of Micromechanics and Microengineering

Volumn 12, Issue 5, 2002, Pages 604-610

Simulation of the filling process in micro channels for polymeric materials

(2) Yao, Donggang a Kim, Byung b

a Oakland University (United States)

b University of Massachusetts (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FILLING; INJECTION MOLDING; MICROMETERS; POLYSTYRENES; SURFACE TENSION; VISCOSITY;

MACROGEOMETRIES; MICROCHANNELS; MICROINJECTION MOLDING; MICROMOLDING; MICROSCALE PHENOMENA;

MICROELECTRONIC PROCESSING;

EID: 0036735589 PISSN: 09601317 EISSN: None Source Type: Journal
DOI: 10.1088/0960-1317/12/5/314 Document Type: Article

Times cited : (206)

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