Flow behavior at the embossing stage of nanoimprint lithography

Fibers and Polymers

Volumn 3, Issue 3, 2002, Pages 113-119

  Jeong, Jun Ho ^a   Choi, Youn Suk ^b   Shin, Young Jae ^a   Lee, Jae Jong ^a   Park, Kyoung Taik ^a   Lee, Eung Sug ^a   Lee, Sang Rok ^a  

^a Korea Institute of Machine and Materials   (South Korea)

^b KyungWon Tech Corporation   (South Korea)

Author keywords

Capillary force; Embossing stage; Nanoimprint lithography; Numerical simulation; Surface tension

Indexed keywords

EID: 2442479009     PISSN: 12299197     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02892627     Document Type: Article

References (12)

1. S. Y. Chou, P. R. Krauss, W. Zhang, L. Guo, and L. Zhuang, J. Vac. Sci. Technol. B, 15, 2897 (1997).
2. L. J. Heydermann, H. Schift, C. David, J. Gobrecht, and T. Schweizer, Microelectronic Engineering, 54, 229 (2000).
3. H. C. Sheer and H. Schulz, Microelectronic Engineering, 56, 311 (2001).
4. X. J. Shen, L. W. Pan, and L. Lin, Sensors and Actuators A, 97-98, 428 (2002).
5. A. Beskok, W. Trimmer, and G. E. Karniadakis, J. Fluid Eng., 118,448 (1996).
6. D. Y. C. Chan and R. G. Horn, J. Chem. Phys., 83, 5311 (1985).
7. C. Jackson, Y. J.Chen, and J. W. Mays, J. Appl. Polym. Sci., 61, 865 (1996).
8. S. Parakar, "Numerical heat transfer and fluid flow", Heisphere Publishing Corp., McGraw Hill, New York, 1980.
9. C. Hirt and B. Nichols, J. Comp. Phy., 39, 201 (1981).
10. D. B. Koth and R. C. Mjolsness, AIAA Journal, 30, 2694 (1992).
11. Z. Tadmor and C. Gogos, "Principles of polymer processing", Wiley, New York, 1970.
12. E. Schaffer, Ph. D. Thesis, University of Groningen, Groningen, 2001.