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Volumn 19, Issue 4, 1996, Pages 270-276
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FCOB reliability evaluation simulating multiple rework/reflow processes
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVE JOINTS;
ELECTRIC RESISTANCE;
ELECTRONICS PACKAGING;
FLIP CHIP DEVICES;
MICROSTRUCTURE;
MULTICHIP MODULES;
PLASTIC ADHESIVES;
PRINTED CIRCUIT BOARDS;
PRINTED CIRCUIT MANUFACTURE;
RELIABILITY;
THERMAL CYCLING;
THERMAL STRESS;
FLIP CHIP ON BOARD (FCOB) ASSEMBLY;
MULTIPLE REFLOW PROCESSES;
SURFACE MOUNT TECHNOLOGY;
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EID: 0030257357
PISSN: 10834400
EISSN: None
Source Type: Journal
DOI: 10.1109/3476.558554 Document Type: Article |
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Times cited : (2)
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References (0)
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