Solder shape design and thermal stress/strain analysis of flip chip packaging using hybrid method

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 44-50

  Liu, Chang Ming ^a   Chiang, Kuo Ning ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTEGRATED CIRCUIT INTERCONNECTS; MODIFIED ATMOSPHERE PACKAGING; RELIABILITY; SOLDERED JOINTS; THERMAL STRESS;

ELECTRONIC PACKAGING INDUSTRY; EQUIVALENT PLASTIC STRAIN; GEOMETRICAL DIMENSIONS; INTERCONNECTION DENSITY; PRACTICAL ENGINEERING APPLICATIONS; STRESS/STRAIN ANALYSIS; THERMALLY INDUCED STRESS; WAFER LEVEL PACKAGING;

PACKAGING;

EID: 84954243633     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904131     Document Type: Conference Paper

References (9)

1. Charles, H. K., and Clatterbaugh, G. V., "Solder Joint Reliability-Design Implications from Finite Element Modeling and Experimental Testing, " ASME Journal of Electronic Packaging, Vol. 112, No.2, 1990, pp.135-146.
2. Shah, M. K., "Analysis of Parameters Influencing Stress in the Solder Joint of Leadless Chip Capacitors, " ASME Journal of Electronic Packaging, Vol.118, No.3, 1990,pp.122-126.
3. Chiang, K. N., and Chen, W. L., "Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array," ASME Journal of Electronic Packaging, Vol.120, 1998, pp. 175-178.
4. Heinrich, S. M., Liedtke, P.E., Nigro, N.J., Elkouh, A. F., and Lee, P.S., "Effect of Chip and Pad Geometry on Solder Joint Formation in SMT," Journal of Electronic Packaging, Vol. 115, 1993, pp. 433-439.
5. Chiang, K.N., Cheng, H.C., "On Enhancing Eutectic Solder Joint Reliability Using A 2nd Reflow Process Approach," ASME Winter Annual Meeting, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures Symposium, EEP-Vol. 24, pp.21-25, Nov. 15-20, 1998, Anaheim, CA, USA
6. Patra, S. K., Sritharan, S. S., and Lee, Y. C, "Quantitative Characterization of a Flip-Chip Solder Joint," Journal of Applied Mechanics, Vol. 62, 1995, pp.390-397.
7. Brakke, K. A., Surface Evolver Manual, Version 2.14, The Geometry Center, 1300 S. Second St., Minneapolis, MN 55454, 1999.
8. Chiang, K. N., Cheng, H. C, Liu, C. M., "A Comparison of Thermal Stress/Strain Behavior of Ellipse/Round Solder Pads," 1999 InterPACK, EEP-Vol.26-1, 1999, pp.413-418, Advances in Electronic Packaging ASME, Hawaii, U.S.A.
9. Yeh, C. P., Zhou, W. X., and Wyatt, K., "Parametric Finite Element Analysis of Flip Chip Reliability," The International Journal of Microcircuits and Electronic Packaging, Vol.19, Number 2, Second Quarter 1996, pp.120-127.