Do chip size limits exist for DCA?

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 4, 1999, Pages 255-263

  Schubert, Andreas ^a,b   Dudek, Rainer ^a,b   Leutenbauer, Rudolf ^b   Döring, Ralf ^b   Kloeser, Joachim ^a,b   Oppermann, H ^a,b   Michel, Bernd ^a,b   Reichl, Herbert ^b   Baldwin, Daniel F ^c   Qu, Jianmin ^c   Sitaraman, Suresh K ^c   Swaminathan, Madhavan ^a,c   Wong, C P ^a,c   Tummala, Rao ^a,c  

^a IEEE

^b FRAUNHOFER IZM   (Germany)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; ELECTRIC CONTACTS; ENCAPSULATION; FLIP CHIP DEVICES; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICE STRUCTURES; SOLDERED JOINTS; STRAIN; SUBSTRATES; THERMAL EXPANSION;

THERMAL EXPANSION MISMATCH;

ELECTRONICS PACKAGING;

EID: 0033320161     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.816091     Document Type: Article

References (15)

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