Fabrication of metal nanowires using microcontact printing

Langmuir

Volumn 19, Issue 15, 2003, Pages 6301-6311

  Geissler, Matthias ^a   Wolf, Heiko ^a   Stutz, Richard ^a   Delamarche, Emmanuel ^a   Grummt, Ulrich Walter ^b   Michel, Bruno ^a   Bietsch, Alexander ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

^b FRIEDRICH SCHILLER UNIVERSITY JENA   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSTS; ELASTOMERS; ELECTROLESS PLATING; GOLD; LIQUID CRYSTAL DISPLAYS; LITHOGRAPHY; METAL FORMING; MICROELECTRONICS; SELF ASSEMBLY; SUBSTRATES; WIRE;

METAL NANOWIRES;

NANOSTRUCTURED MATERIALS;

EID: 0041841490     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la034464x     Document Type: Article

References (55)

1. International Technology Roadmap for Semiconductors 2001, Interconnect. Online at http://public.itrs.net/Files/2001ITRS/Interconnect.pdf.
2. Schnabel, B.; Kley, E.-B.; Wyrowski, F. Opt. Eng. 1999, 38, 220-226.
3. Schider, G.; Krenn, J. R.; Gotschy, W.; Lamprecht, B.; Ditlbacher, H.; Leitner, A.; Aussenegg, F. R. J. Appl. Phys. 2001, 90, 3825-3830.
4. Tanaka, M.; Nose, T.; Sato, S. Jpn. J. Appl. Phys. 2000, 39, 6393-6396.
5. Faver, F.; Walter, E. C.; Zach, M. P.; Benter, T.; Penner, R. M. Science 2001, 293, 2227-2231.
6. Xia, Y.; Whitesides, G. M. Angew. Chem., Int. Ed. Engl. 1998, 37, 551-575.
7. Michel, B.; Bernard, A.; Bietsch, A.; Delamarche, E.; Geissler, M.; Juncker, D.; Kind, H.; Renault, J.-P.; Rothuizen, H.; Sohmid, H.; Schmidt-Winkel, P.; Stutz, R.; Wolf, H. IBM J. Res. Dev. 2001, 45, 697-719.
8. Kumar, A.; Biebuyck, H. A.; Whitesides, G. M. Langmuir 1994, 10, 1498-1511.
9. Bietsch, A.; Michel, B. J. Appl. Phys. 2000, 88, 4310-4318.
10. Donzel, C.; Geissler, M.; Bernard, A.; Wolf, H.; Michel, B.; Hilborn, J.; Delamarche, E. Adv. Mater. 2001, 13, 1164-1167.
11. Xia, Y.; Mrksich, M.; Kim, E.; Whitesides, G. M. J. Am. Chem. Soc. 1995, 117, 9576-9577.
12. Jeon, N. L.; Finnie, K.; Branshaw, K.; Nuzzo, R. G. Langmuir 1997, 13, 3382-3391.
13. Hidber, P. C.; Helbig, W.; Kim, E.; Whitesides, G. M. Langmuir 1996 12 1375-1380.
14. Kind, H.; Geissler, M.; Schmid, H.; Michel, B.; Kern, K.; Delamarche, E. Langmuir 2000, 16, 6367-6373.
15. Bernard, A.; Delamarche, E.; Schmid, H.; Michel, B.; Bosshard, H. R.; Biebuyck, H. Langmuir 1998, 14, 2225-2229.
16. Renault, J. P.; Bernard, A.; Bietsch, A.; Michel, B.; Bosshard, H. R.; Delamarche, E.; Kreiter, M.; Hecht, B.; Wild, U. P. J. Phys. Chem. B 2003, 107, 703-711.
17. Geissler, M.; Schmid, H.; Bietsch, A.; Michel, B.; Delamarche, E. Langmuir 2002, 18, 2374-2377.
18. Xia, Y.; Zhao, X.-M.; Kim, E.; Whitesides, G. M. Chem. Mater. 1995, 7, 2332-2337.
19. Aizenberg, J.; Black, A. J.; Whitesides, G. M. Nature 1999, 398, 495-498.
20. Kumar, A.; Whitesides, G. M. Science 1994, 263, 60-62.
21. Biebuyck, H. A.; Whitesides, G. M. Langmuir 1994, 10, 2790-2793.
22. Delamarche, E.; Michel, B.; Biebuyck, H. A.; Gerber, C. Adv. Mater. 1996, 8, 719-729.
23. Larsen, N. B.; Biebuyck, H. A.; Delamarche, E.; Michel, B. J. Am. Chem. Soc. 1997, 119, 3017-3026.
24. Kumar, A.; Biebuyck, H. A.; Abbott, N. L.; Whitesides, G. M. J. Am. Chem. Soc. 1992, 114, 9188-9189.
25. Xia, Y.; Kim, E.; Whitesides, G. M. J. Electrochem. Soc. 1996, 143, 1070-1079.
26. Carvalho, A.; Geissler, M.; Schmid, H.; Michel, B.; Delamarche, E. Langmuir 2002, 18, 2406-2412.
27. Love, J. C.; Wolfe, D. B.; Chabinyc, M. L.; Paul, K. E.; Whitesides, G. M. J. Am. Chem. Soc. 2002, 124, 1576-1577.
28. Goetting, L. B.; Deng, T.; Whitesides, G. M. Langmuir 1999, 15, 1182-1191.
29. Electroless Plating: Fundamentals and Applications; Mallory, G. O., Hajdu, J. B., Eds.; American Electroplaters and Surface Finishers Society: Orlando, FL, 1990.
30. Paunovic, M.; Schlesinger, M. Fundamentals of Electrochemical Deposition; John Wiley & Sons; New York, 1998; pp 133-160.
31. Delamarche, E.; Schmid, H.; Bietsch, A.; Larsen, N. B.; Rothuizen, H.; Michel, B.; Biebuyck, H. A. J. Phys. Chem. B 1998, 102, 3324-3334.
32. Schmid, H.; Michel, B. Macromolecules 2000, 33, 3042-3049.
33. Huj, C. Y.; Jagota, A.; Lin, Y. Y.; Kramer, E. J. Langmuir 2002, 18, 1394-1407.
34. Johnson, K. L. Contact Mechanics; Cambridge University Press: Cambridge, U.K., 1985.
35. Zhang, H.; Ritchi, I. M.; La Brooy, S. R. J. Electrochem. Soc. 2001, 148, D146-D153.
36. 3+ and thiourea remains reliable for a few hours but tends to decompose at least partially within 1 day when kept under ambient conditions.
37. Folkers, J. P.; Gorman, C. P.; Laibinis, P. E.; Buchholz, S.; Whitesides, G. M.; Nuzzo, R. G. Langmuir 1995, 11, 813-824.
38. Bietsch, A.; Michel, B. Appl. Phys. Lett. 2002, 80, 3346-3348.
39. Sondheimer, E. H. Adv. Phys. 1952, 1, 1-42.
40. Mayadas, A. F.; Shatzkes, M. Phys. Rev. B 1970, 1, 1382-1389.
41. Vancea, J.; Hoffmann, H.; Kastner, K. Thin Solid Films 1984, 121, 201-216.
42. Durkan, C.; Weiland, M. E. Phys. Rev. B 2000, 61, 14215-14218.
43. Li, J.; Hu, X.; Wang, D. Plat. Surf. Finish. 1996, 83, 62-64.
44. Matijeví, E.; Poskanzer, A. M.; Zuman, P. Plat. Surf. Finish. 1976, 62, 968-965.
45. Fujinami, T.; Watanabe, J.; Honma, H. Trans. Inst. Met. Finish. 1998, 74, 193-197.
46. Delamarche, E.; Geissler, M.; Vichiconti, J.; Graham, W. S.; Andry, P. A.; Flake, J. C.; Fryer, P. M.; Nunes, R. W.; Michel, B.; O'Sullivan, E. J.; Schmid, H.; Wolf, H.; Wisnieff, R. L. Langmuir, in press.
47. Cohen, R. L.; D'Amico, J. F.; West, K. W. J. Electrochem. Soc. 1971, 118, 2042-2046.
48. Geissler, M.; Kind, H.; Schmidt-Winkel, P.; Michel, B.; Delamarche, E. Langmuir, in press.
49. Delamarche, E.; Donzel, C.; Kamounah, F. S.; Wolf, H.; Geissler, M.; Stutz, R.; Schmidt-Winkel, P.; Michel, B.; Mathieu, H. J.; Schaumburg, K. Langmuir, submitted.
50. 3 if one refers to the particle mass, where r is the particle radius.
51. Dobisz, E. A.; Bass, R.; Brandow, S. L.; Chen, M.-S.; Dressick, W. J. Appl. Phys. Lett. 2003, 82, 478-480.
52. Hartung, F.; Schmitz, G. Phys. Rev. B 2001, 64, 245418-1-245418-13.
53. Kosolapoff, G. M. J. Am. Chem. Soc. 1945, 67, 1180-1182.
54. The treatment of the glass with a vinyl-terminated silane improved the adhesion between the elastomeric material and the glass because the vinyl groups (at least a fraction of them) can be involved in cross-linking reactions that occur during the formation of the polymer network.
55. Berkenkotter, P.; Stephens, D. In Electroless Plating: Fundamentals and Applications; Mallory, G. O., Hajdu, J. B., Eds.; American Electroplaters and Surface Finishers Society: Orlando, FL, 1990; pp 481-509.