RF MEMS switches fabricated on microwave-laminate printed circuit boards

IEEE Electron Device Letters

Volumn 24, Issue 4, 2003, Pages 227-229

  Chang, Hung Pin ^a   Qian, Jiangyuan ^a   Cetiner, Bedri A ^a   De Flaviis, F ^a   Bachman, Mark ^a   Li, G P ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Compressive molding planarization; High density; Inductively coupled plasma chemical vapor deposition (HDICP CVD); Printed circuit board (PCB); Reconfigurable antennas; RF MEMS switches

Indexed keywords

ANTENNAS; ETCHING; LAMINATES; LOW TEMPERATURE OPERATIONS; MICROELECTRONIC PROCESSING; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR SWITCHES; SILICON NITRIDE;

COMPRESSIVE-MOLDING PLANARIZATION; HIGH DENSITY INDUCTIVELY COUPLED PLASMA CHEMICAL VAPOR DEPOSITION; MICROWAVE-LAMINATE PRINTED CIRCUIT BOARDS; RADIO FREQUENCY MICROELECTRICAL MECHANICAL SYSTEMS CAPACITIVE SWITCHES; RECONFIGURABLE ANTENNAS;

MICROELECTROMECHANICAL DEVICES;

EID: 0038104353     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2003.812150     Document Type: Letter

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