Fabrication of silicon and oxide membranes over cavities using ion-cut layer transfer

Journal of Microelectromechanical Systems

Volumn 9, Issue 4, 2000, Pages 474-477

  Yun, Chang Han ^b,c,d   Cheung, Nathan W ^a,b,e,f,g,h  

^a IEEE

^b UNIVERSITY OF CALIFORNIA   (United States)

^c Seoul National University   (South Korea)

^d UNIVERSITY OF CALIFORNIA   (United States)

^e ELECTROCHEMICAL SOCIETY   (United States)

^f American Vacuum Society   (United States)

^g Materials Research Society   (United States)

^h Bohmische Physical Society

Author keywords

[No Author keywords available]

Indexed keywords

DONOR WAFER CLEAVAGE; ION CUT LAYER TRANSFER; MICRO CHANNELS; OXIDE MEMBRANES; SEALED CAVITIES; WAFER BONDING;

BONDING; HEAT TREATMENT; ION IMPLANTATION; MEMBRANES; OPTICAL PROPERTIES; OXIDES; SEMICONDUCTING SILICON; SILICON ON INSULATOR TECHNOLOGY; SURFACE ROUGHNESS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0034468212     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.896768     Document Type: Article

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