Semiempirical profile simulation of aluminum etching in a Cl2/BCl3 plasma

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 20, Issue 5, 2002, Pages 1536-1556

  Cooperberg, D J ^a   Vahedi, V ^a   Gottscho, R A ^a  

^a 300 Westage Business Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; ALUMINUM; BORON COMPOUNDS; CHLORINE; COMPUTER SIMULATION; DESORPTION; MOLECULAR DYNAMICS; PHOTORESISTS; PROFILOMETRY; SPUTTERING;

PHYSICAL SPUTTERING;

PLASMA ETCHING;

EID: 0036747764     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1494818     Document Type: Article

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