Comprehensive treatment of moisture induced failure - Recent advances

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 25, Issue 3, 2002, Pages 223-230

  Wong, E H ^a   Koh, S W ^b   Lee, K H ^b   Rajoo, R ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Delamination; Finite element; Fracture; Hygroscopic swelling; Moisture; Moisture absorption; Moisture diffusion; Plastic collapse; Popcorn cracking; Vapor pressure

Indexed keywords

ABSORPTION; CRACK INITIATION; DELAMINATION; DIFFUSION; FINITE ELEMENT METHOD; FRACTURE; MATHEMATICAL MODELS; MOISTURE; PLASTICITY; SWELLING; THERMAL EFFECTS; VAPOR PRESSURE;

HYGROSCOPIC SWELLING; MOISTURE ABSORPTION; MOISTURE DIFFUSION; MOISTURE INDUCED FAILURE; PLASTIC COLLAPSE; POPCORN CRACKING;

ELECTRONICS PACKAGING;

EID: 0036665649     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2002.804613     Document Type: Article

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