A simple model for the mode I popcorn effect for IC packages

Microelectronics Reliability

Volumn 40, Issue 8-10, 2000, Pages 1503-1508

  Alpern, P ^a   Lee, K C ^b   Dudek, R ^c   Tilgner, R ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

^c Mech Reliability and Micro Mat   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 8444241619     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00116-5     Document Type: Article

References (5)

1. R. Schmidt, P. Alpern, K. Plecher, R. Tilgner, "Investigation of the adhesion strength between MC and leadframe at higher temperatures", Proc. IEEE/EPTC, 1998, pp. 349-353.
2. I. Fukuzawa, S. Ishiguro, S. Nabu, "Moisture resistance degradation of plastic LSIs by reflow soldering", Proc. IEEE/IRPS, 1985, pp. 192-197.
3. S. Omi, K. Fujita, T. Tsuda, and T. Maeda, "Causes of cracks in SMD and type specific remedies", IEEE Trans. Comp. Hybrids, Manuf. Tech., 14(4), pp. 818 - 823, 1991.
4. J.H. Lim, K.W. Lee, S.S. Park, Y.Y. Earmme, "Vapor pressure analysis of IC packages by fracture mechanics", Proc. IEEE/CPMT El. Pack. Tech. Conf, pp. 36 - 42, 1998, and references therein.
5. nd ed., 1975.