FEA simulation on moisture absorption in PBGA packages under various moisture pre-conditioning

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1078-1082

  Fai, Lam Tim ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; COMPUTER SIMULATION; COPPER; DIFFUSION IN LIQUIDS; FINITE ELEMENT METHOD; MOISTURE;

LOSER ELEMENT DENSITY; MOISTURE PRECONDITIONING; PLASTIC BALL GRID ARRAY;

ELECTRONICS PACKAGING;

EID: 0034479574     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)