Evaluation of interface delamination in IC packages by considering swelling of the molding compound due to moisture absorption

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 84-90

  Tanaka, Naotaka ^a   Kitano, Makoto ^a   Kumazawa, Tetsuo ^a   Nishimura, Asao ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; ADHESION; BOND STRENGTH (MATERIALS); DELAMINATION; INTEGRATED CIRCUITS; INTERFACES (MATERIALS); MOISTURE; RESIDUAL STRESSES; SHEET MOLDING COMPOUNDS; SWELLING;

MOISTURE ABSORPTION;

ELECTRONICS PACKAGING;

EID: 0030686949     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)