Vapor pressure analysis of popcorn cracking in plastic IC packages by fracture mechanics

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 36-42

  Lim, J H ^a   Lee, K W ^a   Park, S S ^a   Earmme, Y Y ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DIFFUSION IN SOLIDS; ELECTROMAGNETIC COMPATIBILITY; FRACTURE MECHANICS; MOISTURE; SOLDERING; VAPOR PRESSURE;

POPCORN CRACKING; REFLOW SOLDERING;

ELECTRONICS PACKAGING;

EID: 0032230453     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)