Advanced moisture diffusion modeling & characterisation for electronic packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1297-1303

  Wong, E H ^a   Koh, S W ^a   Lee, K H ^a   Rajoo, R ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

MULTI-MATERIAL PACKAGES;

BOUNDARY CONDITIONS; COMPUTER SIMULATION; DIFFUSION; ELECTRONIC EQUIPMENT TESTING; FINITE ELEMENT METHOD; HIGH TEMPERATURE EFFECTS; MATHEMATICAL MODELS; MOISTURE; SOLDERING; SORPTION; WETTING;

ELECTRONICS PACKAGING;

EID: 0036297073     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2002.1008273     Document Type: Conference Paper

References (17)

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