Moisture diffusion and vapour pressure modeling of IC packaging

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1372-1378

  Wong, Ee Hua ^a   Teo, Yong Chua ^a   Lim, Thiam Beng ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; INTEGRATED CIRCUITS; MOISTURE; NETWORK COMPONENTS; TIMING CIRCUITS; COMPUTER SOFTWARE; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; PARTIAL DIFFERENTIAL EQUATIONS; SOLDERING; VAPOR PRESSURE;

FICK'S DIFFUSION EQUATION; IC PACKAGE; IC PACKAGING; MOISTURE DIFFUSION; MULTI MATERIALS; PHYSICAL QUANTITIES; VAPOUR PRESSURES;

PACKAGING; ELECTRONICS PACKAGING;

FICK'S DIFFUSION EQUATIONS; SOLDER REFLOW; WETNESS FRACTION;

EID: 0031632977     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678922     Document Type: Conference Paper

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