In-situ measurements of surface mount IC package deformations during reflow soldering

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 20, Issue 3, 1997, Pages 207-212

  Pecht, Michael G ^a   Govind, Anand ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; DEFORMATION; DELAMINATION; ELECTRONICS PACKAGING; MICROELECTRONICS; MOISTURE DETERMINATION; SOLDERING; STRESS ANALYSIS; SURFACE MOUNT TECHNOLOGY; SWELLING; THERMAL EXPANSION; WATER ABSORPTION;

REFLOW SOLDERING; SCANNING ACOUSTIC MICROSCOPY; SURFACE MOUNT PLASTIC ENCAPSULATED MICROCIRCUITS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0031176798     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.649442     Document Type: Article

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