Ultrathin DUV resists for logic applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4690 II, Issue , 2002, Pages 730-740

  Thackeray, J ^a   Cameron, J ^a   Cronin, M ^a   Brykailo, W ^a   Kang, D ^a  

^a SHIPLEY COMPANY   (United States)

Author keywords

248 nm photoresists; Contact holes; ESCAP; Logic gate; Ultrathin films

Indexed keywords

LOGIC GATES; OPTIMIZATION; PHOTOLITHOGRAPHY; SOLVENTS; ULTRATHIN FILMS;

SURFACE INHIBITION;

PHOTORESISTS;

EID: 0036031291     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.474274     Document Type: Conference Paper

References (17)

1. Nguyen, Khanh B.; Lyons, Chris; Schefske, Jeff; Pike, Chris; Phan, Khoi; King, Paul; Levinson, Harry; Bell, Scott; Okoranyanwu, Uzodinma; "Characterization of the Manufacturability of Ultrathin Resist," J. Vac. Technol. B, 17(6), Nov/Dec 1999, pp. 3039-3042.
2. Pike, Christopher; Bell, Scott; Lyons, Chris; Plat, Marina; Levinson, Harry; Okoranyanwu, Uzodinma; "Lithography using ultrathin resist films," J. Vac. Sci. Technol. B 18(6), Nov/Dec 2000, pp. 3360-3363.
3. Asano, M.; Maruyama, Y.; Koike, T.; Chiba, K.; Shiobara, E.; Ikeda, T.; "Enhancement of process latitude by reducing resist thickness for KrF excimer laser lithography," Proc. SPIE, 3333, pp. 869-873 [1998].
4. Cobb, Jonathan; Conley, Will; Guenther, Fred Huang; Lee, J.J.; Lii, Tom; Dakshina-Murthy, S.; Parker, Colita; Usmani, Saifi; Wu, Wei; Hector, Scott; "Integration of Ultrathin Resist Processes into MPU IC Manufacturing Flows," Proc. SPIE, 4345, pp. 261-272 [2001].
5. Maenhoudt, Marielle; Van Goidsenhoven, Diziana; Pollentier, Ivan; Ronse, Kurt; Lepage, Muriel; Struyf, Herbert; Van Hove, Marleen; "Lithography aspects of Dual Damascene interconnect technology," Proc. SPIE, 4404, pp. 1-13 [2001].
6. Gehoel-van Ansem, Wendy F.J.; Linskens, Frank; Pham, Vinh Phuc; "Chemical and Processing Aspects of Thin Imaging Layers," Proc. SPIE, 3678, 837-848 [1999].
7. Plat, Marina; Lyons, Chris; Wilkison, Amanda; Scheffske, Jeff; Kim, Hung-Eil; "The ArF lithography-Challenges, Resolution Capability, and the Mask Error Enhancement Function," Proc. SPIE, 4404, pp. 162-169 [2001].
8. Ito, Hiroshi; Breyta, Greg; Hofer, Donald; Sooriyakumaran, R.; Petrillo, Karen; Seeger, David; Environmentally Stable Chemical Amplification Positive Resist: Principle, Chemistry, Contamination Resistance, and Lithographic Feasibility," J. Photopolym. Sci. Technol., 7, pp. 433-448 [1994].
9. th Intl. Conf. On Photopolymers, Soc. Plast. Eng. Oct. 2000, pp. 133-142.
10. C.A. Mack, K.E. Mueller, A.B. Gardiner, J.P. Sagan, R.R. Dammel, C.G. Willson, "Modeling Solvent Diffusion in Photoresist", J. Vac. Sci. Technol. B, Vol 16(6), pp. 3779-3783 [1998].
11. Rao, Veena; Cobb, Jonathan; Henderson, Craig; Okoranyanwu, Uzodinma; Bozman, Dan; Mangat, Pawitter; Brainard, Robert; Mackevich, Joseph; "Ultrathin Photoresists for EUV Lithography," Proc. SPIE, 3676, pp. 615-626 [1999].
12. Nelson D'amour, J.; Frank, Curtis; Okoroanyanwu, Uzodinma; "Measuring Thermophysical Properties of Ultrathin Photoresist Films," Proc. SPIE, 2002, in press.
13. Okoranyanwu, Uzodinma; "Thin film instabilities and implications for ultrathin resist processes," J. Vac. Sci. Technol. B 18(6), Nov/Dec 2000, pp. 3381-3387.
14. Tsui, Ophelia K.C.; Zhang, H.F.; "Effects of Chain Ends and Chain Entanglement on the Glass Transition Temperature of Polymer Thin Films," Macromolecules, 34, 9139-9142 [2001].
15. Thackeray, James W.; Denison, Mark D.; Fedynyhsyn, Ted; Kang, Doris; Sinta, Roger; "Following the Acid: Effect of Acid Surface Depletion on Phenolic Polymers," ACS Symp. Ser., v. 614, chap. 7, pp. 110-123, Elsa Reichmanis, ed, copyright 1995 ACS.
16. S.A. Robertson, D. Kang, S.A. Scheer, C.J. Brodsky, "Novel Polychromatic Measurement Technique for Determining the Dissolution Rate of Very Thin Resist Films", Proc. SPIE: Metrology, Inspection, and Process Control for Microlithography XVI, 4689, Paper 26 [2002].
17. S.A. Scheer, C. Brodsky, S.A. Robertson, D. Kang, "Design of a Cost Effective Multiwavelength Development Rate Monitoring Tool", Proc. SPIE: Metrology, Inspection, and Process Control for Microlithography XVI, 4689, Paper 113 [2002].