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Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 20, Issue 3, 2002, Pages 1111-1117

Effects of the underlayer substrates on copper chemical vapor deposition

(3) Lin, Cheng Li a Chen, Peng Sen a Chen, Mao Chieh a

a NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; ELECTRIC CONDUCTIVITY; IMPURITIES; METALLIC FILMS; MICROSTRUCTURE; NUCLEATION; SUBSTRATES; TITANIUM NITRIDE;

INCUBATION TIME;

CHEMICAL VAPOR DEPOSITION;

EID: 0035998591 PISSN: 10711023 EISSN: None Source Type: Journal
DOI: 10.1116/1.1481863 Document Type: Conference Paper

Times cited : (5)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.