TiN-CVD process optimization for integration with Cu-CVD

Microelectronic Engineering

Volumn 50, Issue 1-4, 2000, Pages 369-374

  Motte, P ^a   Proust, M ^b   Torres, J ^c   Gobil, Y ^b   Morand, Y ^a   Palleau, J ^c   Pantel, R ^c   Juhel, M ^c  

^a STMICROELECTRONICS   (France)

^b CEA LETI   (France)

^c ORANGE LABS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL VAPOR DEPOSITION; CONTAMINATION; COPPER; DIFFUSION IN SOLIDS; ELECTRIC RESISTANCE; INTERCONNECTION NETWORKS; INTERFACES (MATERIALS); METALLIZING; MICROPROCESSOR CHIPS;

ON-CHIP INTERCONNECTS;

TITANIUM NITRIDE;

EID: 0033640115     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(99)00304-4     Document Type: Article

References (4)

1. Moussavi M., et al. Proceeding of IITC98 :1998;295-297.
2. Zhang J., et al. Proceeding of IITC98 :1998;163-165.
3. Marcadal C., et al. Proceeding VMIC :1997;93-98.
4. W.W. Mullins, J. Appl. Phys., 1 (1) (1959).