Processing and integration of copper interconnects

Solid State Technology

Volumn 41, Issue 3, 1998, Pages 49-59

  Jackson, Robert L ^a   Broadbent, Eliot ^a   Cacouris, Theodore ^a   Harrus, Alain ^a   Biberger, Maximillian ^a   Patton, Evan ^a   Walsh, Tom ^a  

^a Novellus Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CHEMICAL VAPOR DEPOSITION; COPPER; ELECTROPLATING; THIN FILMS;

COPPER INTERCONNECTS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0032010585     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (13)

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3. S. Venkatesan, et al., "A high-performance 1.8 V, 0.20-}mum CMOS technology with copper metallization," Proceedings of IEDM, (IEEE New York, 1997) E31-2, Dec., 1997.
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