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Volumn 37, Issue 15, 1997, Pages 93-98
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Conductive adhesive for surface mount devices
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVES;
ASSEMBLY;
COPPER;
CURING;
ELECTRIC CONDUCTIVITY OF SOLIDS;
ELECTRIC RESISTANCE;
ELECTRONICS INDUSTRY;
EPOXY RESINS;
SILVER;
SOLDERING;
SURFACE MOUNT TECHNOLOGY;
WETTING;
ADHESIVE STRENGTH;
CONDUCTIVE ADHESIVES;
DISPERSION AGENTS;
SOLDER PRODUCTS;
CONDUCTIVE MATERIALS;
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EID: 0031274188
PISSN: 00134945
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (7)
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References (1)
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