Epoxy-based aqueous-processable photodielectric dry film and conductive ViaPlug for PCB build-up and IC packaging

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 138-143

  Gonzalez, C G ^a   Wessel, R A ^a   Padlewski, S A ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; INFILL DRILLING; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATED CIRCUITS; LASER ABLATION; MATERIALS PROPERTIES; NETWORK COMPONENTS; ORGANIC POLLUTANTS; PLASMA ETCHING; POLYCHLORINATED BIPHENYLS; TIMING CIRCUITS; CONDUCTIVE PLASTICS; DIELECTRIC FILMS; EPOXY RESINS; MULTICHIP MODULES; PHOTORESISTS; PRINTED CIRCUIT BOARDS;

BUILDING BLOCKES; CONVENTIONAL METHODS; HIGH-DENSITY INTERCONNECTION; MECHANICAL DRILLING; MULTILAYER CORE; PLASTIC IC PACKAGES; RELIABILITY DATA; TECHNOLOGY CHOICES;

PRINTED CIRCUIT BOARDS; ELECTRONICS PACKAGING;

PHOTODIELECTRIC DRY FILMS;

EID: 0031642468     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678683     Document Type: Conference Paper

References (7)

1. Singer, Adam T., "Microvia Cost Modeling, " Proceedings from IPCWorks, Washington, D. C, October, 1997, S-14-2.
2. Burgess, Larry W., Madden, Paul D., "Blind Vias in SMD Pads, " Printed Circuit Fabrication, Vol. 21, No. 1 (January 1998), pp. 28-29.
3. Bergman, Dieter, "HDI: Where Standardization Is Headed, " a CircuitTree pre-print, expected release March 1998.
4. Castro, Abram, "Chip Carrier Package Constructions Made Easier with Dry Film Photo Dielectric, " Proceedings from IPCWorks, Washington, D. C, October 1997, pp. S01-5-1 toS01-5-7.
5. Thorne', Joan, "Using New Interconnection Technologies To Reduce Substrate Cost, " a pre-print from Proceedings from IPCExpo '98, Long Beach, CA, April 1998, Session S-10.
6. Holden, Happy, et al, IPC Design Guide for HDIS and Microvias (IPC-2315), expected issue on April 1998.
7. Estes, William E., et al, "Photodielectric Dry Films For Ultra High Density Packaging, " Proceedings from SMI, San Jose, CA, August 1997, pp. 47-53.