Polymer/metal composite for interconnection technology

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1995, Pages 1051-1053

  Saraf, R F ^a   Roldan, J M ^a   Jagannathan, R ^a   Sambucetti, C ^a   Marino, J ^a   Jahnes, C ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ELECTRIC PROPERTIES; ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; MULTICHIP MODULES; PARTICLES (PARTICULATE MATTER); RHEOLOGY; SILVER; SOLVENTS; THERMOPLASTICS; VISCOELASTICITY;

POLYMER/METAL COMPOSITE;

METALLIC MATRIX COMPOSITES;

EID: 0029236080     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)