New PCB technologies emerge for high-density interconnect

Electronic Packaging and Production

Volumn 38, Issue 4, 1998, Pages 75-78

  Lasky, Ronald ^a  

^a Assembly Materials Group   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC WIRING; ELECTRONICS PACKAGING; MULTILAYERS; PHOTOLITHOGRAPHY; PRINTED CIRCUIT MANUFACTURE; SUBSTRATES; SURFACES;

BALL GRID ARRAY; CHIP SCALES PACKAGES; HIGH DENSITY INTERCONNECT; TAPE AUTOMATED BONDING; ULTRAFINE PITCH QUAD FLAT PACKS;

PRINTED CIRCUIT BOARDS;

EID: 0032048273     PISSN: 00134945     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (2)

1. Principles of Electronic Packaging, Seraphim, Lasky, and Li, pp. 59-67, McGraw-Hill, 1989, New York, N.Y.
2. Prismark, Cold Spring Harbor, N.Y.