Segregation effect on grain-boundary diffusion in thin metallic films

Thin Solid Films

Volumn 275, Issue 1-2, 1996, Pages 144-147

  Aleshin, A N ^a,c   Bokstein, B S ^b   Egorov, V K ^a   Kurkin, P V ^b  

^a INSTITUTE OF MICROELECTRONICS TECHNOLOGY AND HIGH PURITY MATERIALS   (Russian Federation)

^b NATIONAL UNIVERSITY OF SCIENCE AND TECHNOLOGY MISIS   (Russian Federation)

^c INSTITUTE OF SOLID STATE PHYSICS   (Russian Federation)

Author keywords

Diffusion; Grain boundary; Metals; Segregation

Indexed keywords

ACTIVATION ENERGY; COPPER; DIFFUSION IN SOLIDS; ESTIMATION; GOLD ALLOYS; GRAIN BOUNDARIES; KINETIC THEORY; MATHEMATICAL MODELS; PLATINUM ALLOYS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SEGREGATION (METALLOGRAPHY);

DEPTH CONCENTRATION PROFILES; GILMER-FARREL MODELS; GRAIN BOUNDARY DIFFUSION; HARRISON CLASSIFICATION; HENRY ISOTHERM; KINETIC REGIMES; RUTHERFORD BACKSCATTERING SPECTROMETRY; SEGREGATION EFFECT; WHIPPLE MODELS;

THIN FILMS;

EID: 0030123410     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/0040-6090(95)07028-1     Document Type: Article

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