|
Volumn 278, Issue 1-2, 1996, Pages 6-11
|
Preparation of Ta2Al intermetallic compound films and their application as diffusion barriers to Cu penetration
a,b a a a,c a a
b
HITACHI LTD
(Japan)
|
Author keywords
Contacts; Copper; Diffusion; Metallization; Silicides
|
Indexed keywords
ANNEALING;
AUGER ELECTRON SPECTROSCOPY;
COPPER;
DIFFUSION IN SOLIDS;
INTERFACES (MATERIALS);
INTERMETALLICS;
SILICON;
TANTALUM COMPOUNDS;
THERMAL EFFECTS;
THERMODYNAMIC STABILITY;
COPPER PENETRATION;
DIFFUSION BARRIERS;
INTERFACIAL REACTIONS;
THIN FILMS;
|
EID: 0030146110
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/0040-6090(95)08119-4 Document Type: Article |
Times cited : (8)
|
References (20)
|