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Volumn 278, Issue 1-2, 1996, Pages 6-11

Preparation of Ta2Al intermetallic compound films and their application as diffusion barriers to Cu penetration

Author keywords

Contacts; Copper; Diffusion; Metallization; Silicides

Indexed keywords

ANNEALING; AUGER ELECTRON SPECTROSCOPY; COPPER; DIFFUSION IN SOLIDS; INTERFACES (MATERIALS); INTERMETALLICS; SILICON; TANTALUM COMPOUNDS; THERMAL EFFECTS; THERMODYNAMIC STABILITY;

EID: 0030146110     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/0040-6090(95)08119-4     Document Type: Article
Times cited : (8)

References (20)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.