Wafer bonding technology and its applications in optoelectronic devices and materials

IEEE Journal on Selected Topics in Quantum Electronics

Volumn 3, Issue 3, 1997, Pages 927-936

  Zhu, Z H ^{a,b,c,d,e,f,g,h,i,j}   Ejeckam, Felix E ^a,b,k,l   Qian, Y ^b,c,h,m   Zhang, Jizhi ^b,c,h,m,n   Zhang, Zhenjun ^b,o   Christenson, Gina L ^b,p   Lo, Y H ^a,b,h,q,r  

^a IEEE   (United States)

^b Department of Obstetrics Gynecology   (United States)

^c ZHEJIANG UNIVERSITY   (China)

^d NANJING UNIVERSITY   (China)

^e INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

^f China Institute of Radiowave   (China)

^g UNIVERSITY OF CALIFORNIA   (United States)

^h Cornell University   (United States)

ⁱ China Institute of Electronics CIE   (China)

^j CIE   (China)

^k UNIVERSITY OF HOUSTON   (United States)

^l RICE UNIVERSITY   (United States)

^m INSTITUTE OF SEMICONDUCTORS   (China)

ⁿ Chinese Natl Res Ctr O   (China)

^o UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA   (China)

^p BROWN UNIVERSITY   (United States)

^q NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^r UNIVERSITY OF CALIFORNIA   (United States)

more..

Author keywords

Compliant substrates; Heterostructure; Micromachining; Optoelectronic integration; Vertical cavity surfaceemitting lasers; Water bonding

Indexed keywords

BONDING; ELECTRIC CURRENTS; HETEROJUNCTIONS; INTEGRATED OPTOELECTRONICS; MICROMACHINING; PHOTODETECTORS; SEMICONDUCTOR DEVICE MANUFACTURE; SUBSTRATES;

CONTINUOUS WAVE (CW) THRESHOLD CURRENTS; PULSED THRESHOLD CURRENTS; VERTICAL CAVITY SURFACE EMITTING LASERS (VCSEL); WAFER BONDING TECHNOLOGY;

SEMICONDUCTOR LASERS;

EID: 0031153460     PISSN: 1077260X     EISSN: None     Source Type: Journal    
DOI: 10.1109/2944.640646     Document Type: Article

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