Wafer bonding technology and its applications in optoelectronic devices

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2891, Issue , 1996, Pages 147-158

  Zhu, Zuhua ^a   Ding, Guilan ^a   Chen, Kangsheng ^a   Ejeckam, Felix E ^a   Qian, Yi ^a   Christenson, Gina L ^a   Lo, Yu Hwa ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

SEMICONDUCTOR WAFERS;

BONDING; INTEGRATED OPTOELECTRONICS; SEMICONDUCTOR DEVICE MANUFACTURE; TECHNOLOGY;

OPTOELECTRONIC DEVICES;

EID: 0030401267     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (10)